3D face recognition and compression

Wei Jen Chew, Kah Phooi Seng, Wai Chong Chia, Li Minn Ang, Li Wern Chew

Research output: Book chapter/Published conference paperConference paper

Abstract

Face recognition using 3D images is an important area of research due to its ability to solve problems faced by 2D images like pose changes. In this chapter, a 3D face range recognition and compression system is proposed and the effect of using compressed 3D range images on the recognition rate is investigated. Compression is used to reduce the file size for faster transmission and is performed using the Set Partitioning in Hierarchical Trees (SPIHT) coding method, which is an improvement of the Embedded Zerotree Wavelet (EZW) coding method. Arithmetic Coding (AC) is also performed after SPIHT to further reduce the amount of bits transmitted. Comparing the uncompressed probe images and probe images compressed using SPIHT coding, simulation results show that the compressed image recognition rate ranges from being lower to being slightly higher than uncompressed probe image recognition rate, depending on bit rate. This proves that a 3D face range recognition system using compressed images is a feasible alternative to a system without using compressed images and should be investigated since the benefits like smaller file storage size, faster image transmission time and better recognition rates are important.

Original languageEnglish
Title of host publicationIntelligent Automation and Computer Engineering
Pages107-120
Number of pages14
DOIs
Publication statusPublished - 01 Dec 2010
EventInternational Conference in Intelligent Automation and Computer Engineering, Under the Auspices of the International MultiConference of Engineers and Computer Scientists, IMECS 2009 - Hong Kong, Hong Kong
Duration: 18 Mar 200920 Mar 2009

Publication series

NameLecture Notes in Electrical Engineering
Volume52 LNEE
ISSN (Print)1876-1100
ISSN (Electronic)1876-1119

Conference

ConferenceInternational Conference in Intelligent Automation and Computer Engineering, Under the Auspices of the International MultiConference of Engineers and Computer Scientists, IMECS 2009
CountryHong Kong
CityHong Kong
Period18/03/0920/03/09

Fingerprint

Face recognition
Image recognition
Image communication systems

Cite this

Chew, W. J., Seng, K. P., Chia, W. C., Ang, L. M., & Chew, L. W. (2010). 3D face recognition and compression. In Intelligent Automation and Computer Engineering (pp. 107-120). (Lecture Notes in Electrical Engineering; Vol. 52 LNEE). https://doi.org/10.1007/978-90-481-3517-2-9
Chew, Wei Jen ; Seng, Kah Phooi ; Chia, Wai Chong ; Ang, Li Minn ; Chew, Li Wern. / 3D face recognition and compression. Intelligent Automation and Computer Engineering. 2010. pp. 107-120 (Lecture Notes in Electrical Engineering).
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Chew, WJ, Seng, KP, Chia, WC, Ang, LM & Chew, LW 2010, 3D face recognition and compression. in Intelligent Automation and Computer Engineering. Lecture Notes in Electrical Engineering, vol. 52 LNEE, pp. 107-120, International Conference in Intelligent Automation and Computer Engineering, Under the Auspices of the International MultiConference of Engineers and Computer Scientists, IMECS 2009, Hong Kong, Hong Kong, 18/03/09. https://doi.org/10.1007/978-90-481-3517-2-9

3D face recognition and compression. / Chew, Wei Jen; Seng, Kah Phooi; Chia, Wai Chong; Ang, Li Minn; Chew, Li Wern.

Intelligent Automation and Computer Engineering. 2010. p. 107-120 (Lecture Notes in Electrical Engineering; Vol. 52 LNEE).

Research output: Book chapter/Published conference paperConference paper

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Chew WJ, Seng KP, Chia WC, Ang LM, Chew LW. 3D face recognition and compression. In Intelligent Automation and Computer Engineering. 2010. p. 107-120. (Lecture Notes in Electrical Engineering). https://doi.org/10.1007/978-90-481-3517-2-9